IEEE International Conference on Communications
14-23 June 2021 // Virtual / Montreal
Connectivity – Security – Privacy

Call for Papers

The Workshop on Applications of Affective Sensing in Communication Networks (AffectiCom’21, will be co-located with the IEEE International Conference on Communications (ICC,, taking place in Montreal during June 14-18, 2021. 

The aim of this workshop is to streamline research on affective sensing applications in communication networks. It further comes in response to a steadfastly growing trend in communication context both to facilitate cost-effective sensing, and to utilize the user’s affect to improve the network operation. These include the use of ISM-band equipment to contactlessly capture human movement, pose, breathing rate, etc., and infer affect whether in standalone or a multimodal manner, i.e., with or with video/audio feeds. Another example is the automating QoE capture to improve the networked service delivery.

Toward this aim, the workshop will span the following topics:


  • Affect discretization and modeling
  • Affect emulation
  • Affect synthesis
  • Affective sensing for crowds
  • Applications of affective sensing in
    • AR/VR communications
    • Connected vehicles
    • Crowd control and management
    • Education
    • eHealth
    • Network management
    • Smart cities
  • AI/ML applications in affective sensing
  • Architectures for affective sensing
  • Fusion in multi-modal sensing techniques
  • Generating affective sensing datasets
  • Qualifying affective sensing solutions
Important Dates
Submission deadline: January 20, 2021 February 19, 2021
Notifications: February 20, 2021 March 22, 2021
Camera Ready: March 1, 2021 March 31, 2021 8 April 2021 (FIRM)
Workshop: June 18, 2021
Submissions and Proceedings
We seek original contributions that have neither been previously published nor are currently under review. Authors can submit a full paper (up to 6 pages) that describes complete works in a self-contained manner with the intent to give an oral presentation. For style and submission guidelines, kindly refer to the author on submission guidelines on the IEEE ICC'21 website: Accepted works will be accessible through the IEEE Xplore portal.
Program Committee
Qammer Abbasi, University of Glasgow
Mervat Abulkheir, German University in Cairo
Sarah Adel Bargal, Boston University
Mehrab Bin Morshed, Georgia Institute of Technology
Antonio Fernández Caballero, University of Castilla-La Mancha
M. Fatima Domingues, University of Aveiro
Tahir Emre Kalayci, Virtual Vehicle Research GmbH
‪Vojislav B Mišić, Ryerson University
Ayman Radwan, Instituto de Telecomunicações
Siddharth Siddharth, University of California San Diego
Alessandro Tonacci, National Research Council of Italy (CNR)
Areej Al-Wabil, Alfaisal University
Abd-Elhamid M. Taha, Alfaisal University
Najah Abu Ali, United Arab Emirates University
Ajjen Joshi, Affectiva
Shuai Han, Harbin Institute of Technology

Diamond Patrons

Gold Patrons

Silver Patrons

Bronze Patrons